2.Trends in Placement Techniques
The trend for high density placement techniques is moving from QFP and BGA placement to Package-on-Package and Water Level Chip Scale Package (WLCSP) placement.PoP is especially becoming an essential technique to efficiently place Application Specific Integrated Circuits(ASIC) and memory onto panels for cell phones and digital cameras. The main reason that PoP techniques are used is that ASIC or memory which has passed testing can be handled independently. The use of ASIC or memory for general purpose products reduces stock parts and creates greater freedom for design. This is a hard to achieve with System in Package(SiP) but a characteristic advantages of using PoP techniques.